Challenges in IC design for Networking Products
Challenges in IC design for Networking Products
Presenter: Mojy Chian, Vice President of Core Technology at Mindspeed Technologies™
Host: Alon Orlitsky, Professor in the Department of Electrical and Computer Engineering, University of California, San Diego - contact Prof. Orlitsky through Leah Bellacera at lbellace@soe.ucsd.edu
Date: Thursday, June 20, 2002
Time: 10:00am
Location: CMRR Auditorium, UCSD Campus, La Jolla (directions and parking information)
Live Webcast: http://earth.ucsd.edu:8080/ramgen/encoder/chian.rm
Archived Webcasts available at: http://www.calit2.net/multimedia/archive.html
Courtesy: California Institute for Telecommunications and Information Technology [Calit²]
Abstract: In this presentation, we will review and highlight design challenges facing semiconductor companies providing Integrated Circuits for networking products including routers, switchers, and optical modules. We will review the dynamics of the market and the types of integrated circuits required by networking component manufacturers.
IC design for networking products frequently pushes the limits of performance offered by existing semiconductor and package technologies. Speed, power dissipation, and signal integrity drive technology requirements as well as design style, architecture, and tradeoffs. High levels of integration, up to 200M transistors on a single die, adds another dimension of complexity. These, coupled with design and manufacturing challenges in Deep Sub-Micron processes and very high pin count packages, foster an innovation-based design environment. Electronic design automation tools and robust design methodologies play a major role in managing design complexity, repeatability, and reducing design cycle. Several examples, including a 100M transistor Voice Over Packet IC, will be presented.
Bio: Mojy Chian is currently Vice President of Core Technology at Mindspeed Technologies™, a Conexant Business. In this capacity, he is responsible for all common R&D activities including package engineering, design automation, high performance IP and DSP core development, systems/software development tools and technologies, and design services.
He joined Conexant Systems in 1998 as Executive Director of Virtual Components Solutions. Prior to joining Conexant, he spent ten years at Intersil (Harris Semiconductor). His last position with Intesil was Director of Design Systems. Dr. Chian received his BS, MS, and PhD in electrical engineering as well as an MS in Applied Math from Florida Tech. He holds two US patents, has co-authored over 30 technical publications, and has served as adjunct professor at Florida Tech.