Bio: Professor, Chemical Engineering and Materials Science
Professor, Electrical Engineering and Computer Science
Professor, Integrated Nanosystems Research Facility

Research:  Dr. Shi's current research interests include:

1. Packaging technologies & design tools for opto, fiberoptic and electronic devices
   • Fiber-optic coupling & alignment;
   • Active/passive device packaging/reliability;
   • Low-cost packaging concepts and design;
   • Thermal design;
   • Adhesive curing, Laser welding, Soldering;
   • Mechanical/thermal stress;
   • RF and high frequency electrical packaging issues
2. Electronic and photonic packaging materials and design tools
3. Photonic glass and other novel materials for electronic, fiberoptic and sensor devices
4. IC interconnect, dielectric materials and semiconductor manufacturing issues

Dr. Shi directs the OptoElectronics Integration and Packaging Lab, a research center that serves the evolving needs of the IC and telecommunications industries.